MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm Packing Size: 360×230×360mm

Packing Size: 360×230×360mm

Full-featured professional-grade Octoplus Pro software Software fully supports all operations (Read

Visual calibration of battery settings

Ringtone Amplifier IC If damaged

0 S0 S1 S2 △2

MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm Packing Size: 360×230×360mmMECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,