RELIFE TF1 Mini & TF2 Plus Tempered Insulating Glass PCB Chip Fixture Option:TF1 Mini Hot Air Reworks parts:

Hot Air Reworks parts:

ToolPlus QianLi iCopy-S 4 in 1 test fixture non-removal module for iPhone 6/6P 6S/6SP 7/7P 8/8P X XR XS MAX logic baseband EEPROM chip

Featuring a Greenough optical system with a convergence angle of 10 degree

Product Name: 1 to 10 Boot cable

Input voltage: DC5V-2A

RELIFE TF1 Mini & TF2 Plus Tempered Insulating Glass PCB Chip Fixture Option:TF1 Mini Hot Air Reworks parts:RELIFE TF1 Mini and Relife TF2 Plus tempered heat insulating glass motherboard chip fixture for mobile phone iPad tablet repair. RELIFE TF1 Mini insulated glass clamp for mobile phone PCB board and BGA CPU chip glue removal. RELIFE TF2 Plus motherboard insulated tempered glass holder fixture for Phone motherboard soldering repair. RELIFE TF1 Mini Chip Glass Fixture for Mobile Phone Repair Features: Precise and Secure Clamping: The inward bevel design